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(B)研討會論文

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  1. C. N. Liao, G. J. Chen and K. N. Tu, “Determination of metal/Si contact temperature during electrical current stressing”, Proceedings of 21st International conference on thermoelectrics, page 345, Long Beach, CA, USA (2002).

  2. C. N. Liao and C. T. Wei, “Effect of intermetallic compound formation on electrical properties of Cu/Sn interface during thermal treatment”, TMS 133rd Annual Meeting & Exhibition, Charlotte, North Caroline, USA (2004).

  3. C. N. Liao and W. T. Chen, ”A Study of Eutectic Sn-Pb Solder Wetting Behavior on Cu Strips Under Thermal Stressing”, TMS 133rd Annual Meeting & Exhibition, Charlotte, North Caroline, USA (2004).

  4. C. N. Liao, S. W. Kuo and C. C. Chang, “Effect of interfacial reaction on thermoelectric properties of Bi/Te bilayer thin film”, 23st International Conference on Thermoelectrics, Adelaide, Australia (2004).

  5. C. N. Liao and K. C. Chen, “Thermoelectric properties of annealed ion-implanted silicon thin films”, 15th International Conference on Ion Implantation Technology, Taipei, Taiwan, ROC (2004)

  6. C. N. Liao, C. M. Tai and W. F. Wu. “Fabrication of CMOS-Compatible High-Quality Inductors” , The 12th Symposium on Nano Device Technology (2005)

  7. C. N. Liao, and J. W. Shih, “Effect of group IV element addition on thermoelectric properties of MNiSn-based (M=Ti, Zr) half-Heusler alloys”, 24th International Conference on Thermoelectrics, Clemson, South Caroline, USA (2005).

  8. C. N. Liao and C. M. Tai, “Fabrication and characterization of high-quality thin film inductors in multi-gigahertz frequency”, 2005 奈米國家型科技計畫成果發表會, 台北國際會議中心.

  9. K. C. Chen, C. N. Liao, W. W. Wu and L. J. Chen, “In-situ Microscopic Study of Cu Intragranular Electromigration”, 2005 MRS Fall Meeting, Boston, MA, USA (2005).

  10. C. N. Liao, D. H. She, B. J. Liao and S. W. Kuo, “Preparation of Bismuth Telluride Compound Semiconductors through Thin Film Reactions”, 209th Meeting of The Electrochemical Society, Denver, Colorado, USA, May 7-12, 2006. (Invited)

  11. C. M. Tai and C. N. Liao, “High-quality solenoid inductors on silicon wafers”, International Conference on Communications, Circuits and Systems, Guilin, China, Jun 25-28, 2006.

  12. C. N. Liao, W. J. Chen and J. H. Li, ”Effect of soldering reaction on he electrical properties of bismuth telluride/Cu junctions”, TMS 136th Annual Meeting & Exhibition, Orlando, FL, USA (2007).

  13. C. N. Liao, T. H. She and H. S. Chu, “Preparation of bismuth telluride thin films from thermally annealed Bi/Te multilayer structure”, 26th International Conference on Thermoelectrics, Jeju, Korea (2007).

  14. C. N. Liao, C. H. Lee and W. J. Chen, “Effect of soldering reaction on microstructure and electrical properties of bismuth telluride/Cu junctions”, 26th International Conference on Thermoelectrics, Jeju, Korea (2007).

  15. C. N. Liao, K. C. Chen, W. W. Wu and L. J. Chen, “Enhancement of electromigration resistance in twin-structured copper investigated by in situ transmission electron microscopy”, 2008 MRS Spring Meeting, San Francisco, CA, USA (2008).

  16. K. M. Liou and C. N. Liao, “Effect of electric current assisted thermal treatment on thermoelectric properties of Bi-Sb-Te based thin films prepared by sputtering”, 2008 MRS Spring Meeting, San Francisco, CA, USA (2008).

  17. C. N. Liao, K. C. Chen, W. W. Wu, L. J. Chen and K. N. Tu, “A study of atomic-scale copper electromigration by in-situ transmission electron microscopy”, 2008 International Symposium on Materials for Enabling Nanodevices, Tainan, Taiwan, Sep. 3-5 (2008). (Invited)

  18. C. N. Liao, K. C. Chen, W. W. Wu, L. J. Chen and K. N. Tu, “In-situ TEM study of Electromigration in Cu lines”, 10th International Workshop on Stress-Induced Phenomenon in Metallization, Austin, TX, USA (2008). (Invited)

  19. K. M. Liou and C. N. Liao, ”Effect of electric current assisted thermal treatment on thermoelectric properties of Bi-Sb-Te and Bi-Se-Te based thin films prepared by sputtering”, TMS 138th Annual Meeting & Exhibition, San Francisco, CA, USA (2009).

  20. G. H. Lee and C. N. Liao, ”Effect of Cu addition in Sn solder on the interfacial reaction with element Te substrate”, TMS 138th Annual Meeting & Exhibition, San Francisco, CA, USA (2009).

  21. Y. C. Huang and C. N. Liao,”A study of interfacial reaction between molten Sn-Ag solder and Te substrate”, TMS 138th Annual Meeting & Exhibition, San Francisco, CA, USA (2009).

  22. C. N. Liao, K. M. Liou and H. S. Chu, “Effect of electric current stressing on thermoelectric properties of Bi-Sb-Te and Bi-Se-Te thin films prepared by sputtering”, 28th International Conference on Thermoelectrics, Freiburg, Germany (2009).

  23. C. N. Liao, L. C. Wu, “Enhancement of thermoelectric properties of functionally graded Bi-Sb-Te based compounds by electrical sintering”, 28th International Conference on Thermoelectrics, Freiburg, Germany (2009).

  24. C. N. Liao, “In-situ TEM observation of electromigration in nanotwinned copper”, 2nd Tsukuba-Hsinchu Bilateral Symposium on Advanced Materials Science and Technology, Tsukuba, Japan (2009) (Invited)

  25. C. N. Liao, “Investigation of nanotwinned copper under electromigration by in-situ transmission electron microscopy”, Japan-Taiwan Joint Symposium on New Functional Materials and Their Nano-Scale Analysis, Kyoto, Japan (2009) (Invited)

  26. C. Y. Chang and C. N. Liao, “Thermoelectric properties of sputtered Bi-Sb-Te / Sb multilayer films with electric current assisted annealing”, 2009 MRS Fall Meeting, Boston, MA, USA (2009).

  27. C. N. Liao, K. C. Chen, W. W. Wu, L. J. Chen and K. N. Tu “In-situ Transmission Electron Microscopy Study of Nanotwinned Copper under Electromigration”, IEEE International NanoElectronics Conference, Hong Kong, China (2010).

  28. K. C. Chen, W. W. Wu, H. P. Chen, C. N. Liao, L. J. Chen and K. N. Tu, “Electromigration studies at surfaces and grain boundaries using in-situ TEM”, 11th International Workshop on Stress-Induced Phenomenon in Metallization, Dresden, Germany (2010). (Invited)

  29. C. N. Liao “Thermoelectric transport properties of nanocrystalline bismuth telluride based compounds”, 3rd Tsukuba-Hsinchu Bilateral Symposium on Advanced Materials Science and Technology, Hsinchu, Taiwan, Apr. 2-3, 2010 (Invited)

  30. S. S. Lin and C. N. Liao, “Effect of electric current stressing on thermoelectric properties of hot-pressed Bi-Se-Te nanostructured compounds”, 2010 MRS Spring Meeting, San Francisco, CA, USA (2010).

  31. X. W. Su and C. N. Liao, “Effect of electric current stressing on thermal/electrical transport properties of sputtered Bi-Sb-Te thin films”, 2010 MRS Spring Meeting, San Francisco, CA, USA (2010).

  32. C. N. Liao, K. C. Chen, W. W. Wu, H. P. Chen, L. J. Chen and K. N. Tu, “Stability of nanotwinned Cu under electric current stressing”, International Symposium on Materials for Enabling Nanodevices, UCLA, USA, Sep. 8-10, 2010. (Invited)

  33. C. N. Liao, “In-situ TEM study of twin boundary stability in Cu under electric current stressing” MRS-T 2010 Annual Conference, I-Shou University, Nov. 19-20, 2010. (Invited).

  34. T. C. Chan, Y. L. Chueh and C. N. Liao, “Formation of nanoscale twins in Cu films with controllable orientations by electrodeposition”, E-MRS ICAM IUMRS 2011 Spring Meeting, Nice, France, May 9-13, 2011.

  35. C. N. Liao, “Investigation of atomic scale Cu electro-migration by in-situ TEM”, Joint Symposium on Materials Science & Engineering 2011, NTU, Singapore, June 19-21, 2011. (Invited)

  36. Y. M. Lin, T. C. Chan, Y. L. Chueh and C. N. Liao, “Pulsed electrodeposition of copper nanowires using anodic aluminum oxide (AAO) templates”, International Conference on Materials for Advanced Technologies (ICMAT), Suntec, Singapore, June 26 – July 1, 2011.

  37. S. S. Lin and C. N. Liao, “Effect of electric current stressing on thermoelectric properties of Bi-Se-Te based nanostructured materials prepared by powder metallurgy”, 30th International Conference on Thermoelectrics, Traverse City, Michigan USA, July 17-21 2011.

  38. C. N. Liao, “In-situ TEM study of atomic-scale microstructural evolution in Cu under electric current stressing”, IUMRS International Conference in Asia (IUMRS-ICA), Taipei, Taiwan, September 19-22, 2011. (Invited).

  39. C. Y. Lin, T.-C. Chan, C. N. Liao, “Characterization of nanotwinned Cu films prepared by pulsed electro- deposition at low temperature”, 2012 MRS Spring Meeting, San Francisco, CA, USA, Apr. 9-13, 2012.

  40. L. C. Tseng and C. N. Liao, “Effect of temperature and substrate on microstructure and preferred orientation of copper films prepared by pulsed electrodeposition”, E-MRS 2012 Spring Meeting, Strasbourg, France, May 14-18, 2012.

  41. C. N. Liao, “Introducing Nanoscale Twins in Cu Metallization for Interconnect Applications”, IUMRS International Conference in Asia (IUMRS-ICA), Busan, Korea, August 26-31, 2012. (Invited).

  42. C. N. Liao, “Electromigration induced atomic diffusion and twin boundary migration in nanotwinned copper”, 2012 MRS Fall Meeting, Boston, MI, USA, November 25-30, 2012. (Invited).

  43. M. P. Lu, C. N. Liao, “Effects of pre-press annealing on transport properties of N-type Bi2 (Se, Te)3 compounds prepared by powder metallurgy”, 31st International Conference on Thermoelectrics, Aalborg, Denmark, July 9-12, 2012.

  44. H. H. Huang, C. N. Liao, “Transverse Seebeck effect of junction-structured Bi-Te based compounds”, 31st International Conference on Thermoelectrics, Aalborg, Denmark, July 9-12, 2012.

  45. Y. L. Liu, C. N. Liao, “Characterization of electrical and thermal contact resistances of Bi-Sb-Te/metal interfaces”, 31st International Conference on Thermoelectrics, Aalborg, Denmark, July 9-12, 2012.

  46. P. J. Chen, C. N. Liao, “Thermoelectric transport properties of Bi-Te based thin film on strained flexible substrates”, 32nd International Conference on Thermoelectrics, Kobe, Japan, June 30 - July 4, 2013.

  47. P. W. Kuo, C. N. Liao, Hsu-Shen Chu, “Modeling of transverse Seebeck effect in bismuth telluride based compounds with asymmetrical doping profiles”, 32nd International Conference on Thermoelectrics, Kobe, Japan, June 30 - July 4, 2013.

  48. M. P. Lu, C. N. Liao, “Transverse Seebeck effect of Bi2 (Se, Te)3 bulk with asymmetrical silver and copper doping profiles”, 32nd International Conference on Thermoelectrics, Kobe, Japan, June 30 - July 4, 2013.

  49. H. H. Huang, M. P. Lu and C. N. Liao “Enhancement of Seebeck coefficient of Bi-Te based compounds through gradient doping approach”, 2013 IUMRS-ICAM, Qingdao, China, September 22-28, 2013. (Excellent Poster Award).

  50. L. C. Su, C. N. Liao “Effects of crystallographic texture and gradient doping on thermoelectric transport properties of Bi-Sb-Te compounds”, Materials Research Society 2014 Spring meeting, San Francisco, USA, April 21-25, 2014.

  51. C. C. Wu, C. N. Liao “Enhancement of Seebeck coefficients of thin film Bi-Te based compounds through gradient doping approach”, Materials Research Society 2014 Spring meeting, San Francisco, USA, April 21-25, 2014.

  52. M. P. Lu, C. N. Liao “Effect of Silver Doping in Polycrystalline N-Type Bi2(Se,Te)3 Prepared by Powder Metallurgy”, Materials Research Society 2014 Spring meeting, San Francisco, USA, April 21-25, 2014.

  53. C. N. Liao, K. M. Liou, L. C.Wu, S. S. Lin and M. P. Lu, “Modulation of crystal defects and thermoelectric properties of bismuth telluride based compounds”, 2014 IUMRS-ICEM, Taipei, Taiwan, June 10-14, 2014. (Invited).

  54. P. J. Chen and C. N. Liao, “Manipulation of crystal defects and thermoelectric properties of Bi-Te based thin films on strained flexible substrates”, 2014 TEIChE Annual Meeting, Yuan-Ze University, Taiwan. Dec. 12-13, 2014. (Invited)

  55. M. P. Lu and C. N. Liao, “Effects of silver doping on crystal defects and transport properties of N-type bismuth selenium telluride compounds prepared by powder metallurgy”, TMS 144th Annual Meeting & Exhibition, Orlando, FL, USA, Mar. 15-19, 2015.

  56. T.-T Shen and C. N. Liao, “Effects of tensile stress on thermoelectric properties of Bi-Te based thin films on flexible substrates”, TMS 144th Annual Meeting & Exhibition, Orlando, FL, USA, Mar. 15-19, 2015.

  57. Y. H. Chen, C. N. Liao and H. S. Chu, “Effects of electrical stressing on microstructure and thermoelectric properties of bismuth telluride compounds”, TMS 144th Annual Meeting & Exhibition, Orlando, FL, USA, Mar. 15-19, 2015.

  58. C. W. Hsu and C. N. Liao, “Synthesis and characterization of cupronickel nanowires by low toxicity reducing agent”, 2015 E-MRS Spring Meeting, Lille, France, May 11-15, 2015.

  59. C. L. Huang, C. N. Liao “Stability of twin boundary junction structure in nanotwinned copper nanowires prepared by pulsed electrodeposition”, Materials Research Society 2016 Spring meeting, Phoenix, Arizona, USA, March 28-April 1, 2016.

  60. W. L. Wong, C. N. Liao “Formation of coherent twin intersections in nanotwinned copper nanowire by pulse electrochemical deposition”, Materials Research Society 2016 Spring meeting, Phoenix, Arizona, USA, March 28-April 1, 2016.

  61. C.-Y Hsu and C. N. Liao, “Synthesis of Cu−Ag core-shell nanowires for transparent conductive film applications”, 2016 E-MRS Spring Meeting, Lille, France, May 2-6, 2016.

  62. C.-Y Wang and C. N. Liao, “Synthesis and characterization of cupronickel nanowires by low toxicity reducing agent for transparent conducting film applications”, 2016 E-MRS Spring Meeting, Lille, France, May 2-6, 2016.

  63. J. S. Lee and C. N. Liao, “Characterization and modeling of long-period twin structure in nanotwinned copper”, 2016 E-MRS Spring Meeting, Lille, France, May 2-6, 2016.

  64. C. T. Li, Y. H. Chen and C. N. Liao, “Electromigration and Thermoelectric Transport Properties of Ag in Bi-Sb-Te Systems”, 35th International Conference & The 1st Asian Conference on Thermoelectrics, Wuhan, China, May. 29 – June 2, 2016.

  65. W. L. Chu, C. N. Liao, “Thermoelectric Properties and Microstructure of Sputtered Bi-Sb-Te/Te Multilayered Thin Films”, 35th International Conference & The 1st Asian Conference on Thermoelectrics, Wuhan, China, May. 29 – June 2, 2016.

  66. Y.-H. Chen, C.-T. Li and C. N. Liao*, “Bi-Te based compounds with high-density current stressing: dopant migration, structural evolution and transport property modulation”, TMS 146th Annual Meeting & Exhibition, San Diego, CA, USA, Feb. 26 - Mar. 2, 2017. (Invited).

  67. C. N. Liao, “In-situ TEM observation of electrically driven atomic migration in a copper nanowire with nanometer-scaled twin boundaries”, 4th NIMS-MOST Workshop on Nanocharacterization and Computer Materials Science for Green Energy, Tsukuba, Japan, May. 9-11, 2017. (Invited)

  68. W. L. Weng and C. N. Liao, “Thermally activated microstructure evolution in copper nanowires of high-density nanotwins”, E-MRS Spring Meeting, Strasbourg, France, May 22-26, 2017.

  69. W. H. Lai and C. N. Liao, “Effect of template morphology on crystallographic orientation and microstructure of electro- deposited copper nanowires”, E-MRS Spring Meeting, Strasbourg, France, May 22-26, 2017.

  70. Y. H. Huang and C. N. Liao, “Fabrication and characterization of copper/cuprous oxide nanowire arrays”, E-MRS Spring Meeting, Strasbourg, France, May 22-26, 2017.

  71. L. C. Chen and C. N. Liao, “High-performance Bi-Te based thick films and thermoelectric device prepared by screen printing technology”, E-MRS Spring Meeting, Strasbourg, France, May 22-26, 2017.

  72. H.-H. Fan, W. L. Weng and C. N. Liao, “Flower-like Cu/CuxO nanowire array electrode for non-enzymatic glucose sensing”, E-MRS Spring Meeting, Strasbourg, France, June 18-22, 2018.

  73. W. L. Weng, J.-S. Lee and C. N. Liao*, “Structural stability and chemical reactivity of nanoscale twinning structure in copper nanowires”, TMS 147th Annual Meeting & Exhibition, Phoenix, AZ, USA, Mar. 11 - 15, 2018. (Invited).

  74. C. N. Liao, “Theoretical and experimental assessment of nanoprecipitation on thermoelectric transport properties of bismuth antimony telluride”, The 3rd Asian Conference on Thermoelectrics (ACT3) & The 5th Micro & Nanoscale Heat Transfer and Energy Workshop (MNHTE2018), Taipei, Taiwan, Oct. 7 - 9, 2018 (Invited).

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