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​Publication List​

(A) 期刊論文

  1. C. N. Liao and K. N. Tu, (2002), “Direct measurement of contact temperature using Seebeck potential”, J. Appl. Phys., 92, 635 (SCI) NSC- 90-2218-E-007-067 IF:2.079   4

  2. C. N. Liao and K. C. Chen, (2003), “Current crowding effect on thermal characteristics of Ni/doped-Si contacts”, IEEE Electron Device Letters, 24, 637 (SCI) NSC-91-2216-E007-050 IF:2.719  1

  3. C. N. Liao and C. T. Wei, (2004),”Effect of intermetallic compound formation on electrical properties of Cu/Sn interface during thermal treatment”, J. Electron. Mat., 33, 1137 (SCI) NSC-92-2216-E-007-023 IF:1.421   12

  4. C. N. Liao and K. M. Liou, (2005), “Electrical properties of Cu/Ta interfaces under electrical current stressing”, J. Vac. Sci. Tech. A, 23, 359 (SCI) IF:1.291   2

  5. C. N. Liao and S. W. Kuo, (2005), “Thermoelectric characterization of sputter-deposited Bi/Te bilayer thin films”, J. Vac. Sci. Tech. A, 23, 559 (SCI) NSC-93-2216-E-007-026 IF:1.291   5

  6. C. N. Liao and K. C. Chen, (2005) “Effect of interfacial resistance and contact size on current crowding at Ni/poly-Si junctions”, Semi. Sci. Tech., 20, 659 (SCI) IF:1.333  1

  7. C. N. Liao, K. C. Chen, W. W. Wu and L. J. Chen, (2005) “In situ transmission electron microscope observations of electromigration in copper lines at room temperature”, Appl. Phys. Lett., 87, 141903. (SCI) IF:3.841   14

  8. C. N. Liao, C. P. Chung and W. T. Chen, (2005) “Electromigration induced Pb Segregation in Eutectic Sn-Pb Molten Solder”, J. Mat. Res., 20, 3425 (SCI) NSC-93-2216-E-007-045 IF:1.402   1

  9. C. N. Liao and C. T. Wei, (2006) “An isochronal kinetic study of intermetallic compound growth in Sn/Cu thin film couples”, Thin Solid Films, 515, 2781 (SCI) NSC-92-2216-E-007-023 IF:1.935   6

  10. C. N. Liao, H. N. Wu, P. C. Chen and J. W. Yeh, (2006) “Effect of antimony doping on thermoelectric properties of Zr0.5Ti0.5NiSn multi-element alloys”, ANNALES DE CHIMIE - science des matériaux, 31(6), 711 (SCI) NSC-93-2216-E-007-026.   0

  11. C. N. Liao, T. H. She, P. J. Liao and H. S. Chu, (2007) “Oscillatory transport properties of thermally annealed Bi/Te multilayer thin films”, J. Electrochem. Soc. 154 (4), H304 (SCI) NSC-94-2216-E-007-019. IF:2.427   3

  12. C. M. Tai and C. N. Liao, (2007) “Multi-level suspended thin film inductors on silicon wafers”, IEEE Trans. Electron. Dev., 54 (6), 1510 (SCI) IF:2.267   0

  13. C. N. Liao and T. H. She, (2007) “Preparation of bismuth telluride thin films through interfacial reaction”, Thin Solid Films, 515, 8059 (SCI) NSC-94-2216-E-007-019. IF:1.935  8

  14. K. C. Chen, C. N. Liao, W. W. Wu and L. J. Chen, (2007) “Direct observation of electromigration-induced surface atomic steps in Cu lines by in-situ transmission electron microscopy”, Appl. Phys. Lett., 90, 203101. (SCI) IF:3.841   9

  15. C. M. Chen, C. C. Huang, C. N. Liao, and K. M. Liou, (2007) “Effects of copper doping on microstructural evolution in eutectic SnBi solder stripes under annealing and current stressing”, J. Electron. Mat. 36, 760 (SCI) IF:1.421   13

  16. C. N. Liao, C. H. Lee and W. J. Chen, (2007) “Effect of interfacial compound formation on contact resistivity of soldered junctions between bismuth telluride based thermoelements and copper”, Electrochem. Solid-State Lett., 10(9), P23 (SCI) NSC 95-2221-E-007-051 IF:1.981   2

  17. C. M. Tai and C. N. Liao, (2007) ”A Physical Model of Solenoid Inductors on Silicon Substrates”, IEEE Trans. Microwave Theory Tech., 55(12), 2579 (SCI) IF:2.025   6

  18. C. N. Liao, K. M. Liou and H. S. Chu, (2008) “Enhancement of thermoelectric properties of sputtered Bi-Sb-Te thin films by electric current stressing”, Appl. Phys. Lett., 93, 042103. (SCI) NSC-96-2628-E-007-018-MY3 IF:3.841   15

  19. K. C. Chen, W. W. Wu, C. N. Liao, L. J. Chen and K. N. Tu, (2008) “Observation of Atomic Diffusion at Twin-modified Grain Boundaries in Copper”, Science, 321, 1066 (SCI) NSC-96-2628-E-007-018-MY3 IF:31.377   57

  20. S. D. Li, J. G. Duh and C. N. Liao, (2008) “High-frequency ferromagnetic inductors covered by as-deposited FeCoAlO films with stress-induced uniaxial anisotropy”, Thin Solid Films, 516, 7748 (SCI) IF:1.935  5

  21. C. N. Liao and C. H. Lee, (2008) “Suppression of vigorous liquid Sn/Te reactions by Sn-Cu solder alloys”, J. Mat. Res., 23, 3303 (SCI) NSC-96-2628-E-007-018-MY3 IF:1.402   3

  22. C. N. Liao, Y. C. Wang and H. S. Chu, (2008) “Thermal transport properties of nanocrystalline Bi–Sb–Te thin films prepared by sputter deposition”, J. Appl. Phys., 104, 104302 (SCI) NSC-96-2628-E-007-018-MY3 IF:2.079   7

  23. C. N. Liao and L. C. Wu, (2009) “Enhancement of carrier transport properties of BixSb2-xTe3 compounds by electrical sintering process”, Appl. Phys. Lett., 95, 052112. (SCI) NSC-96-2628-E-007-018-MY3 IF:3.841   3

  24. C. N. Liao, L. C. Wu and J. S. Lee, (2010) “Thermoelectric properties of Bi-Sb-Te materials prepared by electric current stressing”, J. Alloys Compd., 490, 468. (SCI) NSC-96-2628-E-007-018-MY3 IF:2.135   7

  25. C. N. Liao and Y. C. Huang, (2010) “Effect of Ag addition in Sn on growth of SnTe compound during reaction between molten solder and tellurium”, J. Mat. Res., 25, 391 (SCI) NSC-96-2628-E-007-018-MY3 IF:1.402   2

  26. C. N. Liao, C. Y. Chang and H. S. Chu, (2010) “Thermoelectric properties of electrically stressed Sb/Bi–Sb–Te multilayered films”, J. Appl. Phys., 107, 066103 (SCI) NSC-96-2628-E-007-018-MY3 IF:2.079   2

  27. K. M. Liou and C. N. Liao, (2010) “Electric current enhanced defect elimination in thermally annealed Bi-Sb-Te and Bi-Se-Te thermoelectric thin films”, J. Appl. Phys., 108, 053711 (SCI) NSC-96-2628-E-007-018-MY3 IF:2.079   1

  28. K. C. Chen, W. W. Wu, C. N. Liao, L. J. Chen and K. N. Tu, (2010) “Stability of nanoscale twins in copper under electric current stressing”, J. Appl. Phys. 108, 066103 (SCI). IF:2.079   1

  29. C. N. Liao, H. D. Shih and P. W. Su, (2010) “Electrocrystallization of Mutually Crossed Bismuth Telluride Nanoplatelets”, J. Electrochem. Soc. 157, D605 (SCI) NSC 98-3114-E-007-008. IF:2.427   0

  30. C. N. Liao, W. T. Chen and C. H. Lee, (2010) “Polarity effect on interfacial reactions at soldered junctions of electrically stressed thermoelectric modules”, Appl. Phys. Lett. 97, 241906. (SCI) NSC 98-3114-E-007-008. IF:3.841   0

  31. C. H. Lee, W. T. Chen and C. N. Liao, (2011) “Effect of antimony on vigorous interfacial reaction of Sn-Sb/Te couples”, J. Alloys Compd., 509, 5142 (SCI) NSC 98- 3114-E-007-008. IF:2.135  0

  32. C. N. Liao, X. W. Su, K. M. Liou and H. S. Chu, (2011) “Electrical and thermal transport properties of electrically stressed Bi-Sb-Te nanocrystalline thin films”, Thin Solid Films, 519, 4394. (SCI) NSC 98- 3114-E-007-008. IF:1.935   0

  33. T. C. Chan, K. C. Chen and C. N. Liao, (2011) “Surface roughness reduction of nanocrystalline Cu thin films by electrical stressing treatment”, Appl. Phys. Lett., 98, 181902. (SCI) NSC 99-2221-E-007-023-MY3. IF:3.841   2

  34. T. C. Chan, Y. L. Chueh and C. N. Liao, (2011) “Manipulating the crystallographic texture of nanotwinned Cu films by electrodeposition”, Cryst. Growth Des., 11, 4970. (SCI) NSC 99-2221-E-007-023-MY3. IF:4.390   0

  35. S. S. Lin and C. N. Liao, (2011) “Effect of ball milling and post treatment on crystal defects and transport properties of Bi2(Se,Te)3 compounds”, J. Appl. Phys., 110, 093707 NSC 98- 3114-E-007-008. IF:2.079  1

  36. T. Y. Lin, C. N. Liao, A. T. Wu, (2012) “Evaluation of diffusion barrier between lead-free solder systems and thermoelectric materials”, J. Electron. Mat. 41, 153 (SCI) IF:1.421  0

  37. C. N. Liao, Y. C. Lu and D. Xu, (2013) “Modulation of crystallographic texture and twinning structure of Cu nanowires by electrodeposition”, J. Electrochem. Soc. 160 (6), D207 (SCI) NSC-99-2221-E-007-023-MY3 2.588

  38. M.-P. Lu and C. N. Liao, (2013) “Mechanical and thermal processing effects on crystal defects and thermoelectric transport properties of Bi2(Se,Te)3 compounds”, J. Alloys Comp. 571,178–182. (SCI) NSC-101-2628- E-007-018-MY2 2.390, 4/76

  39. C. N. Liao, C.-Y. Lin, C.-L. Huang and Y.-S. Lu, (2013) “Morphology, Texture and Twinning Structure of Cu Films Prepared by Low-temperature Electroplating”, J. Electrochem. Soc. 160 (12), D3070 (SCI) NSC-99-2221-E-007-023-MY3

  40. H.-H. Huang, M.-P. Lu, C.-H. Chiu, L.-C. Su, C. N. Liao, J.-Y. Huang, H.-L. Hsieh, (2013) “Enhanced Seebeck coefficient of bismuth telluride compounds with graded doping profiles”, Appl. Phys. Lett., 103, 163903. (SCI) NSC-101-2628- E-007-018-MY2 3.794 20/128

  41. P. H. Le, C. N. Liao, C. W. Luo, J.-Y. Lin, J. Leu, (2013) “Thermoelectric properties of bismuth-selenide films with controlled morphology and texture grown using pulsed laser deposition”, Appl. Surf. Sci., 285P, 657-663 (SCI). 2.112

  42. T. C. Chan, Y. M. Lin, H. W. Tsai, Z. M. Wang, C. N. Liao, Y. L. Chueh, (2014) “Growth of large-scale nanotwinned Cu nanowire arrays from anodic aluminum oxide membrane by electrochemical deposition process: Controllable nanotwin density and growth orientation with enhanced electrical endurance performance”, Nanoscale, 6, 7332. (SCI) NSC-99 -2221-E-007-023-MY3.

  43. H. W. Tsai, T. H. Wang, T. C. Chan, P. J. Chen, C. C. Chung, A. Yaghoubi, C. N. Liao, E. W.-G. Diau, Y. L. Chueh, (2014) “Fabrication of Large Scale Single Crystal Bismuth Telluride (Bi2Te3) Nanosheet Arrays by Single Step Electrolysis Process”, Nanoscale, 6, 7780. (SCI)

  44. Y. L. Liu and C. N. Liao, (2014) “Experimental and theoretical assessments of thermal boundary resistance between Bi0.4Sb1.6Te3 thin films and metals”, Appl. Phys. Lett., 105, 013903. (SCI) NSC-101-2628- E-007-018-MY2

  45. P. H. Le, C. N. Liao, C. W. Luo, J. Leu, (2014) “Thermoelectric properties of nanostructured bismuth-telluride thin films grown using pulsed laser deposition”, J. Alloys Comp. 615, 546–552. (SCI)

  46. P.-J. Chen and C. N. Liao, (2014) “Thermoelectric transport properties of Bi-Te based thin films on strained polyimide substrates”, Appl. Phys. Lett., 105, 133903. (SCI) NSC-101-2628- E-007-018-MY2

  47. T.-C. Chan, Y.-Z. Chen, Y.-L. Chueh*, C. N. Liao*, (2014) “Large-scale nanotwins in copper films/Cu nanowires via stress engineering by high energy ion beam bombardment process: growth and characterization”, J. Mater. Chem. C, 2, 9777-10038. (SCI) NSC-99 -2221-E-007-023-MY3. (Inside front cover)

  48. C.-J. Yang, C.-L. Huang and C. N. Liao*, (2015) “Enhancing chemical stability of electroplated Cu films by engineering electrolyte chemistry and twinning structure”, J. Electron. Mat. 44, 2529 (SCI) NSC 102-2221-E-007-048-MY3

  49. C.-L. Huang and C. N. Liao*, (2015) “Chemical reactivity of twin-modified copper nanowire surfaces”, Appl. Phys. Lett., 107, 021601 (SCI) NSC 102-2221-E-007-048- MY3.

  50. M.-P. Lu, C. N. Liao*, J.-Y. Huang, H.-C. Hsu, (2015) “Thermoelectric Properties of Ag-Doped Bi2(Se,Te)3 Compounds: Dual Electronic Nature of Ag-Related Lattice Defects”, Inorg. Chem., 54, 7438. (SCI) MOST 103-2221-E-007 -035  4/45

  51. H.-P. Chen, C.-W. Huang, C.-W. Wang, W.-W. Wu, C.-N. Liao, L.-J. Chen and K.-N. Tu, (2016), “Optimization of the nanotwin-induced zigzag surface of copper by electromigration”, Nanoscale, 8, 2584.

  52. Y.-T. Huang, C.-W. Huang, J.-Y. Chen, Y.-H. Ting, S.-L. Cheng, C.-N. Liao and W.-W. Wu, (2016), “Mass transport phenomena in copper nanowires at high current density”, Nano Research, 9, 1071.

  53. H.-H. Huang, M.-P. Lu and C. N. Liao*, (2016), “Transverse thermoelectric effect of asymmetrically doped Bi-Sb-Te compounds”, J. Appl. Phys., 119, 205101.

  54. T. T. Shen, C. N. Liao*, (2017), “Enhancement of fatigue resistance of Bi-Sb-Te films on flexible substrates by current-assisted thermal annealing”, Mater. Lett., 186, 314-317.

  55. J.-S. Lee, W.-L. Weng, C. N. Liao*, (2017), “Characterization and modeling of twinning superlattice structure in copper nanowires”, Mater. Lett., 194, 23-25.

  56. Y.-H. Chen and C. N. Liao*, (2017), “Scattering characteristics of grain boundaries in electrically sintered Bi0.4Sb1.6Te3 compounds”, Mater. Lett., 197, 21-23.

  57. Y.-H. Chen and C. N. Liao*, (2017), “Transport properties of electrically sintered bismuth antimony telluride with antimony nanoprecipitation”, Appl. Phys. Lett., 111, 143901.

  58. C.-L. Huang, W.-L. Weng, C. N. Liao*, K. N. Tu, (2018) “Suppression of interdiffusion- induced voiding in oxidation of copper nanowires with twin-modified surface”, Nat. Commun. 9, 340.

  59. C.-T. Li, Y.-H. Chen, C. N. Liao*, (2018) “Electrically motivated atomic migration and defect formation in Bi0.5Sb1.5Te3 compounds”, Mater. Chem. Phys., 204, 373-377. (SCI)

  60. J.-C. Hsiao, Y.-H. Chen, C. N. Liao*, (2018) “Anisotropic thermal conductivity of sputtered Bi0.5Sb1.5Te3 films after current-assisted thermal treatment”, Thin Solid Films, 645, 93-96.

  61. W.-L. Weng, C.-Y. Hsu, J.-S. Lee, H.-H. Fan, C. N. Liao*, (2018) “Twin-mediated epitaxial growth of highly lattice-mismatched Cu/Ag core–shell nanowires”, Nanoscale, 10, 9862-9866.

  62. C.-L. Huang, W.-L. Weng, Y.-S. Huang C. N. Liao*, (2019) ”Enhanced photolysis stability of Cu2O grown on Cu nanowires with nanoscale twin boundaries”, Nanoscale, 11, 13709 - 13713. DOI: 10.1039/c9nr01406c. (Outside Back Cover).

  63. H.-H. Fan, W.-L. Weng, C.-Y. Lee, C. N. Liao*, (2019) “Electrochemical Cycling-Induced Spiky CuxO/Cu Nanowire Array for Glucose Sensing”, ACS Omega, 4, 12222 – 12229.

  64. C.-Y. Lan, C.-Y. Hsu, Y.-C. Lee, C. N. Liao*, (2020) “Grain growth behavior and enhanced thermoelectric properties of PbTe consolidated by high-density pulse current”, J. Alloys Comp., 815, 1526582.

  65. P.-C. Wei, C. N. Liao, H.-J. Wu, D. Yang, J. He, G. V. Biesold-McGee, S. Liang, W.-T. Yen, X. Tang, J.-W. Yeh, Z. Lin, and J. H. He (2020), “Thermodynamic routes to ultra-low thermal conductivity and high thermoelectric performance”, Adv. Mater., 32, 1906457.

  66. P.-S. Chang and C. N. Liao*, (2020), “Screen-printed flexible thermoelectric generator with directional heat collection design”, J. Alloys Comp., 836, 155471.

  67. C.-W. Chen and C. N. Liao*, (2021) “Enhanced thermoelectric properties of screen-printed Bi-Sb-Te films on flexible substrate by electrical sintering process”, Mater. Chem. Phys. 259, 124006.

  68. Y.-S. Huang, H.-Y. Chen and C. N. Liao*, (2021) “Growth of nanotwinned Cu nanowires in modified anodic aluminum oxide templates” Mater. Lett. 288, 129381.

  69. H.-Y. Chen, Y.-S. Huang and C. N. Liao*, (2021) “Electrodeposition and growth mechanism of nanotwinned copper in high aspect-ratio via structures” J. Electrochem. Soc. 168, 102503.

  70. M.-J. Yang, M. Y. Fakhri, C. N. Liao*, K.-H. Chen, (2022) “Synthesis and characterization of Ge-Ag-Sb-S-Se-Te high-entropy thermoelectric alloys” Mater. Lett. 311, 131617.

  71. P.-H. Sung, C.-Y. Huang, C.-Y. Lin, P.-W. Chung, Y.-C. Chang, L.-C. Chen, H.-Y. Chen, C. N. Liao,*, E.-L. Chiu, C.-Y. Wang, (2022) “Photocatalytic CO2 Reduction for C2-C3 Oxy-compounds on ZIF-67 Derived Carbon with TiO2”, J. CO2 Util. 58, 101920.

  72. S.-Y. Chien, L.-C. Hou , C.-C. Li , C. N. Liao*, (2022) “Flexible thermoelectric generators prepared by dispenser printing technology”, Mater. Chem. Phys. 287, 126269.

  73. T.-K. Chang, Y.-S. Huang, H.-Y. Chen, C. N. Liao*, (2022) “Photoelectrochemical Enhancement of Cu2O by a Cu2Te Hole Transmission Interlayer”, ACS Appl. Mater. Interfaces 14, 48540−48546. (Inside Cover).

  74. W.-L. Weng, H.-Y. Chen, Y.-H. Ting, H.-Y. T. Chen, W.-W. Wu, K. N. Tu, C. N. Liao*, (2022) “Twin-boundary Reduced Surface Diffusion on Electrically Stressed Copper Nanowires”, Nano Lett. 22, 9071−9076.

  75. J.-C. Yu, H.-C. Chien, C.-Y. Chiang, E.-C. Liu, Y.-H. Chang, H.-H. Huang, T.-Y. Chen, C.-L. Kao, C. N. Liao* (2023)“ High-performance electrodeposited copper wicks for heat-spreading vapor chambers“, Appl. Therm. Eng. 228, 120495 (IF: 6.4, MECHANICS, 9/137).

  76. E.-C. Liu, J.-C. Yu, C.-Y. Chiang, C. N. Liao* (2023) “Enhancing capillary performance of copper wicks by electrodeposition of superhydrophilic dendritic structures“, Mater. Chem. Phys. 307, 128207.

  77. C.-Y. Chiang, J.-C. Yu, E.-C. Liu, S.-W. Chiu, C.-N. Liao* (2023) “Enhanced Capillary Performance of Hierarchical Dendritic Copper Surface for Ultra-thin Heat-spreading Devices”, Phys. Fluids 35, 072117 (IF: 4.6, PHYSICS, FLUIDS & PLASMAS, 2/34).

  78. S.-Y. Chen, L.-Y. Wang, K.-C. Chen, C.-H. Yeh, W.-C. Hsiao, H.-Y. Chen, M. Nishi, M. Keller, C.-L. Chang, C. N. Liao, T. Mochizuki, H.-Y. Tiffany Chen, H. H. Chou, C.-M. Yang, (2024) “Ammonia synthesis over cesium-promoted mesoporous-carbon-supported ruthenium catalysts: Impact of graphitization degree of the carbon support”, Appl. Catal., B, 346, 123725. (IF:22.1, ENGINEERING, ENVIRONMENTAL, 1/55)

  79. J.-C. Yu, C. N. Liao*, Y.-H. Chang, H.-H. Huang, C.-C. Wang, C.-P. Hung (2024) “Enhanced Heat Spreading Performance of Printed Circuit Boards by Vapor Chamber Implementation”, IEEE Trans. Compon. Packag. Manuf. Technol., 14, 221-228.

  80. H.-Y. Chen, M.-C. Tai, C. N. Liao* (2024) “Mechanistic understanding of enhanced thermal stability of twinned copper nanowires”, Mater. Today Phys., 43, 101407. (IF: 11.5, PHYSICS, APPLIED, 14/160)

  81. Y.-F. Tsai, M.-J. Yang, J.-R. Deng, C. N. Liao, H.-J. Wu* (2024) “Reducing Domain Density Enhances Conversion Efficiency in GeTe”, Small, 20, 2312206 (IF:13.3, PHYSICS, APPLIED, 11/160)

  82. H.-Y. Chen, S.-Y. Chen*, Y. I. A. Reyes, M. Keller, T. Mochizuki, C. N. Liao, H.-Y. T. Chen*, (2024) “Promotion effects in ammonia synthesis over ruthenium catalysts: A review”, EnergyChem, 6, 100140. (IF:22.2, ENGINEERING, CHEMICAL, 3/170)

  83. Y. C. Huang, H.-Y. Chen, C. N. Liao* (2025) “Electrodeposition of Cu nanowires with ultrahigh-density twin boundaries: An electrochemical perspective on nanotwinning”, Nanoscale, 17, 2312 – 2317. DOI: 10.1039/D4NR03537B. (IF: 5.8, PHYSICS, APPLIED, 33/179)

  84. P.-H. He, C.-Y. Chiang, J.-C. Yu, E.-C. Liu, C. N. Liao* (2025) “Effect of Hydrogen Evolution on Morphology and Capillary Performance of Electrodeposited Copper Wicks”, Mater. Chem. Phys. 337, 130560.

  85. H.-Y. Chen, H.-Y. T. Chen and C.-N. Liao* (2025) “Mechanistic understanding of self-limiting oxidation behavior of copper nanowires with dense twin boundaries”, Appl. Surf. Sci. 692, 162753.

  86. C.-Y. Chiang, P.-H. He, H.-C. Chien, J.-C. Yu, E.-C. Liu, L.-C. Chen, Y.-H. Chang, H.-H. Huang, C.-C. Wange, C.-P. Hung, C. N. Liao* (2025) “Implementation of Hierarchical Dendritic Wicks in Vapor Chambers for High-Power Heat Dissipation Applications“, Appl. Therm. Eng. 126295. (IF: 6.1, ENGINEERING, MECHANICAL, 10/183)

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(B)  研討會論文

  1. C. N. Liao, G. J. Chen and K. N. Tu, “Determination of metal/Si contact temperature during electrical current stressing”, Proceedings of 21st International conference on thermoelectrics, page 345, Long Beach, CA, USA (2002).

  2. C. N. Liao and C. T. Wei, “Effect of intermetallic compound formation on electrical properties of Cu/Sn interface during thermal treatment”, TMS 133rd Annual Meeting & Exhibition, Charlotte, North Caroline, USA (2004).

  3. C. N. Liao and W. T. Chen, ”A Study of Eutectic Sn-Pb Solder Wetting Behavior on Cu Strips Under Thermal Stressing”, TMS 133rd Annual Meeting & Exhibition, Charlotte, North Caroline, USA (2004).

  4. C. N. Liao, S. W. Kuo and C. C. Chang, “Effect of interfacial reaction on thermoelectric properties of Bi/Te bilayer thin film”, 23st International Conference on Thermoelectrics, Adelaide, Australia (2004).

  5. C. N. Liao and K. C. Chen, “Thermoelectric properties of annealed ion-implanted silicon thin films”, 15th International Conference on Ion Implantation Technology, Taipei, Taiwan, ROC (2004)

  6. C. N. Liao, C. M. Tai and W. F. Wu. “Fabrication of CMOS-Compatible High-Quality Inductors” , The 12th Symposium on Nano Device Technology (2005)

  7. C. N. Liao, and J. W. Shih, “Effect of group IV element addition on thermoelectric properties of MNiSn-based (M=Ti, Zr) half-Heusler alloys”, 24th International Conference on Thermoelectrics, Clemson, South Caroline, USA (2005).

  8. C. N. Liao and C. M. Tai, “Fabrication and characterization of high-quality thin film inductors in multi-gigahertz frequency”, 2005 奈米國家型科技計畫成果發表會, 台北國際會議中心.

  9. K. C. Chen, C. N. Liao, W. W. Wu and L. J. Chen, “In-situ Microscopic Study of Cu Intragranular Electromigration”, 2005 MRS Fall Meeting, Boston, MA, USA (2005).

  10. C. N. Liao, D. H. She, B. J. Liao and S. W. Kuo, “Preparation of Bismuth Telluride Compound Semiconductors through Thin Film Reactions”, 209th Meeting of The Electrochemical Society, Denver, Colorado, USA, May 7-12, 2006. (Invited)

  11. C. M. Tai and C. N. Liao, “High-quality solenoid inductors on silicon wafers”, International Conference on Communications, Circuits and Systems, Guilin, China, Jun 25-28, 2006.

  12. C. N. Liao, W. J. Chen and J. H. Li, ”Effect of soldering reaction on he electrical properties of bismuth telluride/Cu junctions”, TMS 136th Annual Meeting & Exhibition, Orlando, FL, USA (2007).

  13. C. N. Liao, T. H. She and H. S. Chu, “Preparation of bismuth telluride thin films from thermally annealed Bi/Te multilayer structure”, 26th International Conference on Thermoelectrics, Jeju, Korea (2007).

  14. C. N. Liao, C. H. Lee and W. J. Chen, “Effect of soldering reaction on microstructure and electrical properties of bismuth telluride/Cu junctions”, 26th International Conference on Thermoelectrics, Jeju, Korea (2007).

  15. C. N. Liao, K. C. Chen, W. W. Wu and L. J. Chen, “Enhancement of electromigration resistance in twin-structured copper investigated by in situ transmission electron microscopy”, 2008 MRS Spring Meeting, San Francisco, CA, USA (2008).

  16. K. M. Liou and C. N. Liao, “Effect of electric current assisted thermal treatment on thermoelectric properties of Bi-Sb-Te based thin films prepared by sputtering”, 2008 MRS Spring Meeting, San Francisco, CA, USA (2008).

  17. C. N. Liao, K. C. Chen, W. W. Wu, L. J. Chen and K. N. Tu, “A study of atomic-scale copper electromigration by in-situ transmission electron microscopy”, 2008 International Symposium on Materials for Enabling Nanodevices, Tainan, Taiwan, Sep. 3-5 (2008). (Invited)

  18. C. N. Liao, K. C. Chen, W. W. Wu, L. J. Chen and K. N. Tu, “In-situ TEM study of Electromigration in Cu lines”, 10th International Workshop on Stress-Induced Phenomenon in Metallization, Austin, TX, USA (2008). (Invited)

  19. K. M. Liou and C. N. Liao, ”Effect of electric current assisted thermal treatment on thermoelectric properties of Bi-Sb-Te and Bi-Se-Te based thin films prepared by sputtering”, TMS 138th Annual Meeting & Exhibition, San Francisco, CA, USA (2009).

  20. G. H. Lee and C. N. Liao, ”Effect of Cu addition in Sn solder on the interfacial reaction with element Te substrate”, TMS 138th Annual Meeting & Exhibition, San Francisco, CA, USA (2009).

  21. Y. C. Huang and C. N. Liao,”A study of interfacial reaction between molten Sn-Ag solder and Te substrate”, TMS 138th Annual Meeting & Exhibition, San Francisco, CA, USA (2009).

  22. C. N. Liao, K. M. Liou and H. S. Chu, “Effect of electric current stressing on thermoelectric properties of Bi-Sb-Te and Bi-Se-Te thin films prepared by sputtering”, 28th International Conference on Thermoelectrics, Freiburg, Germany (2009).

  23. C. N. Liao, L. C. Wu, “Enhancement of thermoelectric properties of functionally graded Bi-Sb-Te based compounds by electrical sintering”, 28th International Conference on Thermoelectrics, Freiburg, Germany (2009).

  24. C. N. Liao, “In-situ TEM observation of electromigration in nanotwinned copper”, 2nd Tsukuba-Hsinchu Bilateral Symposium on Advanced Materials Science and Technology, Tsukuba, Japan (2009) (Invited)

  25. C. N. Liao, “Investigation of nanotwinned copper under electromigration by in-situ transmission electron microscopy”, Japan-Taiwan Joint Symposium on New Functional Materials and Their Nano-Scale Analysis, Kyoto, Japan (2009) (Invited)

  26. C. Y. Chang and C. N. Liao, “Thermoelectric properties of sputtered Bi-Sb-Te / Sb multilayer films with electric current assisted annealing”, 2009 MRS Fall Meeting, Boston, MA, USA (2009).

  27. C. N. Liao, K. C. Chen, W. W. Wu, L. J. Chen and K. N. Tu “In-situ Transmission Electron Microscopy Study of Nanotwinned Copper under Electromigration”, IEEE International NanoElectronics Conference, Hong Kong, China (2010).

  28. K. C. Chen, W. W. Wu, H. P. Chen, C. N. Liao, L. J. Chen and K. N. Tu, “Electromigration studies at surfaces and grain boundaries using in-situ TEM”, 11th International Workshop on Stress-Induced Phenomenon in Metallization, Dresden, Germany (2010). (Invited)

  29. C. N. Liao “Thermoelectric transport properties of nanocrystalline bismuth telluride based compounds”, 3rd Tsukuba-Hsinchu Bilateral Symposium on Advanced Materials Science and Technology, Hsinchu, Taiwan, Apr. 2-3, 2010 (Invited)

  30. S. S. Lin and C. N. Liao, “Effect of electric current stressing on thermoelectric properties of hot-pressed Bi-Se-Te nanostructured compounds”, 2010 MRS Spring Meeting, San Francisco, CA, USA (2010).

  31. X. W. Su and C. N. Liao, “Effect of electric current stressing on thermal/electrical transport properties of sputtered Bi-Sb-Te thin films”, 2010 MRS Spring Meeting, San Francisco, CA, USA (2010).

  32. C. N. Liao, K. C. Chen, W. W. Wu, H. P. Chen, L. J. Chen and K. N. Tu, “Stability of nanotwinned Cu under electric current stressing”, International Symposium on Materials for Enabling Nanodevices, UCLA, USA, Sep. 8-10, 2010. (Invited)

  33. C. N. Liao, “In-situ TEM study of twin boundary stability in Cu under electric current stressing” MRS-T 2010 Annual Conference, I-Shou University, Nov. 19-20, 2010. (Invited).

  34. T. C. Chan, Y. L. Chueh and C. N. Liao, “Formation of nanoscale twins in Cu films with controllable orientations by electrodeposition”, E-MRS ICAM IUMRS 2011 Spring Meeting, Nice, France, May 9-13, 2011.

  35. C. N. Liao, “Investigation of atomic scale Cu electro-migration by in-situ TEM”, Joint Symposium on Materials Science & Engineering 2011, NTU, Singapore, June 19-21, 2011. (Invited)

  36. Y. M. Lin, T. C. Chan, Y. L. Chueh and C. N. Liao, “Pulsed electrodeposition of copper nanowires using anodic aluminum oxide (AAO) templates”, International Conference on Materials for Advanced Technologies (ICMAT), Suntec, Singapore, June 26 – July 1, 2011.

  37. S. S. Lin and C. N. Liao, “Effect of electric current stressing on thermoelectric properties of Bi-Se-Te based nanostructured materials prepared by powder metallurgy”, 30th International Conference on Thermoelectrics, Traverse City, Michigan USA, July 17-21 2011.

  38. C. N. Liao, “In-situ TEM study of atomic-scale microstructural evolution in Cu under electric current stressing”, IUMRS International Conference in Asia (IUMRS-ICA), Taipei, Taiwan, September 19-22, 2011. (Invited).

  39. C. Y. Lin, T.-C. Chan, C. N. Liao, “Characterization of nanotwinned Cu films prepared by pulsed electro- deposition at low temperature”, 2012 MRS Spring Meeting, San Francisco, CA, USA, Apr. 9-13, 2012.

  40. L. C. Tseng and C. N. Liao, “Effect of temperature and substrate on microstructure and preferred orientation of copper films prepared by pulsed electrodeposition”, E-MRS 2012 Spring Meeting, Strasbourg, France, May 14-18, 2012.

  41. C. N. Liao, “Introducing Nanoscale Twins in Cu Metallization for Interconnect Applications”, IUMRS International Conference in Asia (IUMRS-ICA), Busan, Korea, August 26-31, 2012. (Invited).

  42. C. N. Liao, “Electromigration induced atomic diffusion and twin boundary migration in nanotwinned copper”, 2012 MRS Fall Meeting, Boston, MI, USA, November 25-30, 2012. (Invited).

  43. M. P. Lu, C. N. Liao, “Effects of pre-press annealing on transport properties of N-type Bi2 (Se, Te)3 compounds prepared by powder metallurgy”, 31st International Conference on Thermoelectrics, Aalborg, Denmark, July 9-12, 2012.

  44. H. H. Huang, C. N. Liao, “Transverse Seebeck effect of junction-structured Bi-Te based compounds”, 31st International Conference on Thermoelectrics, Aalborg, Denmark, July 9-12, 2012.

  45. Y. L. Liu, C. N. Liao, “Characterization of electrical and thermal contact resistances of Bi-Sb-Te/metal interfaces”, 31st International Conference on Thermoelectrics, Aalborg, Denmark, July 9-12, 2012.

  46. P. J. Chen, C. N. Liao, “Thermoelectric transport properties of Bi-Te based thin film on strained flexible substrates”, 32nd International Conference on Thermoelectrics, Kobe, Japan, June 30 - July 4, 2013.

  47. P. W. Kuo, C. N. Liao, Hsu-Shen Chu, “Modeling of transverse Seebeck effect in bismuth telluride based compounds with asymmetrical doping profiles”, 32nd International Conference on Thermoelectrics, Kobe, Japan, June 30 - July 4, 2013.

  48. M. P. Lu, C. N. Liao, “Transverse Seebeck effect of Bi2 (Se, Te)3 bulk with asymmetrical silver and copper doping profiles”, 32nd International Conference on Thermoelectrics, Kobe, Japan, June 30 - July 4, 2013.

  49. H. H. Huang, M. P. Lu and C. N. Liao “Enhancement of Seebeck coefficient of Bi-Te based compounds through gradient doping approach”, 2013 IUMRS-ICAM, Qingdao, China, September 22-28, 2013. (Excellent Poster Award).

  50. L. C. Su, C. N. Liao “Effects of crystallographic texture and gradient doping on thermoelectric transport properties of Bi-Sb-Te compounds”, Materials Research Society 2014 Spring meeting, San Francisco, USA, April 21-25, 2014.

  51. C. C. Wu, C. N. Liao “Enhancement of Seebeck coefficients of thin film Bi-Te based compounds through gradient doping approach”, Materials Research Society 2014 Spring meeting, San Francisco, USA, April 21-25, 2014.

  52. M. P. Lu, C. N. Liao “Effect of Silver Doping in Polycrystalline N-Type Bi2(Se,Te)3 Prepared by Powder Metallurgy”, Materials Research Society 2014 Spring meeting, San Francisco, USA, April 21-25, 2014.

  53. C. N. Liao, K. M. Liou, L. C.Wu, S. S. Lin and M. P. Lu, “Modulation of crystal defects and thermoelectric properties of bismuth telluride based compounds”, 2014 IUMRS-ICEM, Taipei, Taiwan, June 10-14, 2014. (Invited).

  54. P. J. Chen and C. N. Liao, “Manipulation of crystal defects and thermoelectric properties of Bi-Te based thin films on strained flexible substrates”, 2014 TEIChE Annual Meeting, Yuan-Ze University, Taiwan. Dec. 12-13, 2014. (Invited)

  55. M. P. Lu and C. N. Liao, “Effects of silver doping on crystal defects and transport properties of N-type bismuth selenium telluride compounds prepared by powder metallurgy”, TMS 144th Annual Meeting & Exhibition, Orlando, FL, USA, Mar. 15-19, 2015.

  56. T.-T Shen and C. N. Liao, “Effects of tensile stress on thermoelectric properties of Bi-Te based thin films on flexible substrates”, TMS 144th Annual Meeting & Exhibition, Orlando, FL, USA, Mar. 15-19, 2015.

  57. Y. H. Chen, C. N. Liao and H. S. Chu, “Effects of electrical stressing on microstructure and thermoelectric properties of bismuth telluride compounds”, TMS 144th Annual Meeting & Exhibition, Orlando, FL, USA, Mar. 15-19, 2015.

  58. C. W. Hsu and C. N. Liao, “Synthesis and characterization of cupronickel nanowires by low toxicity reducing agent”, 2015 E-MRS Spring Meeting, Lille, France, May 11-15, 2015.

  59. C. L. Huang, C. N. Liao “Stability of twin boundary junction structure in nanotwinned copper nanowires prepared by pulsed electrodeposition”, Materials Research Society 2016 Spring meeting, Phoenix, Arizona, USA, March 28-April 1, 2016.

  60. W. L. Wong, C. N. Liao “Formation of coherent twin intersections in nanotwinned copper nanowire by pulse electrochemical deposition”, Materials Research Society 2016 Spring meeting, Phoenix, Arizona, USA, March 28-April 1, 2016.

  61. C.-Y Hsu and C. N. Liao, “Synthesis of Cu−Ag core-shell nanowires for transparent conductive film applications”, 2016 E-MRS Spring Meeting, Lille, France, May 2-6, 2016.

  62. C.-Y Wang and C. N. Liao, “Synthesis and characterization of cupronickel nanowires by low toxicity reducing agent for transparent conducting film applications”, 2016 E-MRS Spring Meeting, Lille, France, May 2-6, 2016.

  63. J. S. Lee and C. N. Liao, “Characterization and modeling of long-period twin structure in nanotwinned copper”, 2016 E-MRS Spring Meeting, Lille, France, May 2-6, 2016.

  64. C. T. Li, Y. H. Chen and C. N. Liao, “Electromigration and Thermoelectric Transport Properties of Ag in Bi-Sb-Te Systems”, 35th International Conference & The 1st Asian Conference on Thermoelectrics, Wuhan, China, May. 29 – June 2, 2016.

  65. W. L. Chu, C. N. Liao, “Thermoelectric Properties and Microstructure of Sputtered Bi-Sb-Te/Te Multilayered Thin Films”, 35th International Conference & The 1st Asian Conference on Thermoelectrics, Wuhan, China, May. 29 – June 2, 2016.

  66. Y.-H. Chen, C.-T. Li and C. N. Liao*, “Bi-Te based compounds with high-density current stressing: dopant migration, structural evolution and transport property modulation”, TMS 146th Annual Meeting & Exhibition, San Diego, CA, USA, Feb. 26 - Mar. 2, 2017. (Invited).

  67. C. N. Liao, “In-situ TEM observation of electrically driven atomic migration in a copper nanowire with nanometer-scaled twin boundaries”, 4th NIMS-MOST Workshop on Nanocharacterization and Computer Materials Science for Green Energy, Tsukuba, Japan, May. 9-11, 2017. (Invited)

  68. W. L. Weng and C. N. Liao, “Thermally activated microstructure evolution in copper nanowires of high-density nanotwins”, E-MRS Spring Meeting, Strasbourg, France, May 22-26, 2017.

  69. W. H. Lai and C. N. Liao, “Effect of template morphology on crystallographic orientation and microstructure of electro- deposited copper nanowires”, E-MRS Spring Meeting, Strasbourg, France, May 22-26, 2017.

  70. Y. H. Huang and C. N. Liao, “Fabrication and characterization of copper/cuprous oxide nanowire arrays”, E-MRS Spring Meeting, Strasbourg, France, May 22-26, 2017.

  71. L. C. Chen and C. N. Liao, “High-performance Bi-Te based thick films and thermoelectric device prepared by screen printing technology”, E-MRS Spring Meeting, Strasbourg, France, May 22-26, 2017.

  72. H.-H. Fan, W. L. Weng and C. N. Liao, “Flower-like Cu/CuxO nanowire array electrode for non-enzymatic glucose sensing”, E-MRS Spring Meeting, Strasbourg, France, June 18-22, 2018.

  73. W. L. Weng, J.-S. Lee and C. N. Liao*, “Structural stability and chemical reactivity of nanoscale twinning structure in copper nanowires”, TMS 147th Annual Meeting & Exhibition, Phoenix, AZ, USA, Mar. 11 - 15, 2018. (Invited).

  74. C. N. Liao, “Theoretical and experimental assessment of nanoprecipitation on thermoelectric transport properties of bismuth antimony telluride”, The 3rd Asian Conference on Thermoelectrics (ACT3) & The 5th Micro & Nanoscale Heat Transfer and Energy Workshop (MNHTE2018), Taipei, Taiwan, Oct. 7 - 9, 2018 (Invited).

  75. C. N. Liao*, Y.-H. Chen and C.-Y. Lan, “Current-induced boundary modification and precipitation in telluride based thermoelectric materials”, TMS 148th Annual Meeting & Exhibition, San Antonio, TX, USA, Mar. 10 - 14, 2019. (Invited).

  76. C. W. Chen and C. N. Liao, “High-performance screen-printed Bi-Sb-Te thick films sintered by current-assisted hot pressing”, 38th International Conference on Thermoelectrics (ICT 2019), Gyeongju, Korea, Jun. 30 – July 4, 2019.

  77. C. -Y. Hsu and C. N. Liao, “Fabrication and characterization of Ge0.87Pb0.13Te compounds prepared by current-assisted sintering method”, 38th International Conference on Thermoelectrics (ICT 2019), Gyeongju, Korea, Jun. 30 – July 4, 2019.

  78. P. H. Chang and C. N. Liao, “Fabrication and characterization of Bi-Te based thermoelectric module on a flexible substrate.” 38th International Conference on Thermoelectrics (ICT 2019), Gyeongju, Korea, Jun. 30 – July 4, 2019.

  79. M.-J. Yang, P.-F. Lee, C. N. Liao “Process and characterization of Ge-Sb-Ag-S-Se-Te high-entropy thermoelectric materials”，2021 Taiwan Thermoelectric Society Annual Meeting, Yi-Lan, Jan. 19-20, 2021.

  80. S.-Y. Chien, C. N. Liao, “Flexible Bi-Te based thermoelectric thick film modules fabricated by dispenser printing method”, 2021 Taiwan Thermoelectric Society Annual Meeting, Yi-Lan, Jan. 19-20, 2021.

  81. C. N. Liao, “Challenges and opportunities of flexible thermoelectric devices based on printing technology”, TMS 2021 150th Virtual Annual Meeting & Exhibition, March 15-18, 2021. (Invited).

  82. C. N. Liao, “Development of dispenser printing technology for flexible thermoelectric generators”, 2021 MRS-T International Conference, Nov. 13-17.2021. (Invited).

  83. C. N. Liao, “Modular flexible thermoelectric generators for ambient energy recovery”, TMS 2022 150th Annual Meeting & Exhibition, Feb. 27 - March 3, 2022. (Invited).

  84. S.-Y. Chien, C. N. Liao, “Flexible thermoelectric generators prepared by dispenser printing technology”, 2022 Taiwan Thermoelectric Society Annual Meeting, Yi-Lan, August 23-24, 2022. (Invited)

  85. H.-Y. Chen, C.-N. Liao, “Thermal stability and defect annihilation of twinned copper nanowires” 2022 MRS-T International Conference, Nov. 18-19, 2022.

  86. L.-C. Hou, C. N. Liao “Process Development of Flexible Thermoelectric Modules Based on Printing and Sintering Technology”, Materials Research Society 2023 Spring meeting, San Francisco, CA, USA, April 10-14, 2023.

  87. J.-C. Yu, C.-Y. Chiang, E.-C. Liu, C. N. Liao “High-performance electrodeposited copper wicks for heat-spreading vapor chambers”, Materials Research Society 2023 Spring meeting, San Francisco, CA, USA, April 10-14, 2023.

  88. L.-C. Hou, C. N. Liao “Process Development of Flexible Thermoelectric Modules Based on Printing and Sintering Technology”, Materials Research Society 2023 Spring meeting, San Francisco, CA, USA, April 10-14, 2023.

  89. C. R. Wu, C. N. Liao, “Low thermal conductivity and High thermoelectric performance of Germanium-Copper-Antimony-Selenium-Tellurium Thermoelectric Materials”, 2023 Taiwan Thermoelectric Society Annual Meeting, Hualien, Aug. 28-29, 2023. (Best Poster Award)

  90. Y.-E. Tsai, C.-L. Shieh, C. N. Liao, “Development of Ag-to-Ag Direct Bonding for Ge-Pb-Te thermoelectric and Cu electrodes with electroless plated M/Ni diffusion barrier”, 2023 Taiwan Thermoelectric Society Annual Meeting, Hualien, Aug. 28-29, 2023.

  91. L.-C. Hou, S.-Y. Chien, C. N. Liao, “Process development of flexible thermoelectric modules based on printing and sintering technology”, 2023 Taiwan Thermoelectric Society Annual Meeting, Hualien, Aug. 28-29, 2023.

  92. C. Y. Chiang, J. C. Yu, E. C. Liu, and C. N. Liao, “Development of Electrodeposited Hierarchical Dendritic Wick Structure for Ultra-Thin Vapor Chamber Applications”, 244th ECS Meeting, Gothenburg, Sweden, October 8-12, 2023.

  93. E.-C. Liu, J.-C. Yu, C.-Y. Chiang, C. N. Liao, “Tailoring Substrate Topography to Enhance Wicking Performance of Electrodeposited Cu Porous Films”, 244th ECS Meeting, Gothenburg, Sweden, October 8-12, 2023.

  94. H. Y. Chen and C. N. Liao, “Pulse-Electrodeposition and Growth Mechanism of Nanotwinned Copper Nanowires inside High Aspect-Ratio Anodic Aluminum Oxide”, 244th ECS Meeting, Gothenburg, Sweden, October 8-12, 2023.

  95. Hao-Che Huang, Hsin-Yu Chen, Chien-Neng Liao, Control of Crystallographic Growth Orientation and Twinning Structure in Copper Nanowires by Template-Assisted Electrodeposition, 244th ECS Meeting, Gothenburg, Sweden, October 8-12, 2023.

  96. Y.-E. Tasi, C. L. Shieh, C. N. Liao. “Development of Ag-to-Ag Direct Bonding for Ge-Pb-Te thermoelectric and Cu electrodes with electroless plated M/Ni diffusion barrier”, IMPACT 2023 Conference, Taipei, Taiwan, October 25-27, 2023.

  97. P. H. He, J. C. Yu, C. Y. Chiang, C. N Liao, “Effect of hydrogen evolution on morphology and capillary performance of electrodeposited copper wicks”, 2023 MRS-T, Hsinchu, Nov. 17-20, 2023. (Excellent Poster Award)

  98. Hao-Che Huang, Hsin-Yu Chen, Chien-Neng Liao, Control of crystallographic growth and twinning structure in copper nanowires by template-assisted electrodeposition, 2023 MRS-T, Hsinchu, Nov. 17-20, 2023.

  99. W. C. Lai, M. Y. Fakhri, S. M. Valiyaveettil, B. Jarwal, L.C. Chen, C.N. Liao, and K. H. Chen “Enhanced thermoelectric properties of p-type SnS through Na/Ag co-doping approach”, 2023 MRS-T, Hsinchu, Nov. 17-20, 2023.

  100. C. R. Wu, C. N. Liao, “Low thermal conductivity and high thermoelectric performance of GeSbSeTe-based alloys by Cu doping”, 2023 MRS-T, Hsinchu, Nov. 17-20, 2023. (Best Poster Award).

  101. Hsin-Yu Chen, Chien-Neng Liao, Investigation of thermally induced grain boundary migration in copper nanowires with twin boundaries, 2023 MRS-T, Hsinchu, Nov. 17-20, 2023.

  102. L. C. Hou, C. N. Liao “Process development of flexible thermoelectric modules based on printing and sintering technology”, TMS 2024 Annual Meeting & Exhibition, Orlando, Florida, USA, March 3-7, 2024.

  103. Y. E. Tasi, C.L Shieh, C. N. Liao “Development of Ag-to-Ag Direct Bonding Technique for Ge-Pb-Te Thermoelectric Materials and Cu Electrodes”, TMS 2024 Annual Meeting & Exhibition, Orlando, Florida, USA, March 3-7, 2024.

  104. H. Y. Chen, C. N. Liao, Mechanistic Investigation of Twinned Copper Nanowires as a Multi-functional Materials, TMS 2024 Annual Meeting & Exhibition, Orlando, Florida, USA, March 3-7, 2024.

  105. J. H. Liao, C. N. Liao, Stabilization of dendritic copper wick structure through a two-step electrodeposition process, TMS 2024 Annual Meeting & Exhibition, Orlando, Florida, USA, March 3-7, 2024.

  106. C. R. Wu, C. N. Liao, Enhancing thermoelectric properties of GeTe-based medium-entropy thermoelectric materials, TTES, Hualien, Taiwan, July 22-23, 2024.

  107. W. C. Lai, M. Y. Fakhri, K. H. Chen, L.C. Chen, and C.N. Liao, A study of interfacial reaction of Ni(P)/SnS couples, TTES, Hualien, Taiwan, July 22-23, 2024.

  108. C. R. Wu, C. N. Liao, Modulation of crystal structure and thermoelectric properties of GeTe-based compounds with Sb and Se alloying, MRS Fall meeting, Boston, USA, December 1-6, 2024.

​

(C)  專利

  1. 廖建能、吳歷杰、李建興，專利名稱：半導體塊材之製造方法，中華民國專利 發明第 I423490號，公告日:2014/01/11，專利權期間2014年1月11日至2029年9月27日。

  2. 闕郁倫、詹宗晟、廖建能，專利名稱：高密度雙晶金屬薄膜的製作方法，中華民國專利 發明第I419985號，公告日:2013/12/21，專利權期間2013年12月21日至2031年10月10日。

  3. 闕郁倫、詹宗晟、廖建能、林彥妙，專利名稱：具高密度雙晶的奈米銅導線製造方法，中華民國專利 發明第I454422號，公告日:2014/10/1，專利權期間2014年10月1日至2032年4月11日。

  4. 廖建能、詹宗晟，專利名稱：降低金屬薄膜表面粗糙度的方法，中華民國專利 發明第 I469219號，公告日:2015/01/11，專利權期間2015年1月11日至2029年2月15日。

  5. 朱旭山、廖建能、陳耀祥，專利名稱：用於退火裝置的樣品座與使用此樣品座的電流輔助退火裝置，中華民國專利 發明第 I509698號，公告日:2015/11/21，專利權期間2015年11月21日至2033年12月24日。

  6. 林明志、蔡杰燊、廖建能、吳鎭吉，專利名稱：一種熱電轉換元件，中華民國專利 發明第 I575786號，公告日:2017/3/21，專利權期間2017年3月21日至2034年4月7日。

  7. Yu-Lun Chueh, Tsung-Cheng Chan, Chien-Neng Liao, Title: Method for forming metal film with twins, US Patent 8,420,185. April 16, 2013.

  8. 廖建能、盧孟珮、戴明吉、陳力祺、黃泓憲，專利名稱：熱電模組，中華民國專利 發明第 I586006號，公告日:2017/06/01，專利權期間2017年6月1日至2035年12月9日。

  9. 黃菁儀、廖建能，專利名稱：熱電模組，中華民國專利 發明第 I641167號，公告日:2018/11/11，專利權期間2018年11月11日至2036年12月20日。

  10. Jian-Hong Lin, Chwei-Ching Chiu, Yung-Huei Lee, Chien-Neng Liao, Yu-Lun Chueh, CHAN Tsung-Cheng, Chun-lung Huang, Title: Interconnect structure with twin boundaries and method for forming the same, US Patent 9,761,523 September12, 2017.

  11. 廖建能、盧孟珮、戴明吉、陳力祺、黃泓憲，專利名稱：熱電模塊，中華人民共和國專利，發明第 ZL 2015 1 0909644.7號，公告日: 2019/4/23，專利權期間2019年4月23日至2039年4月22日。

​

(D) 其它

  1. J. H. Jou and C. N. Liao, “Bending beam technique for the measurement of solvent diffusions in polymer containing layered structures”, Handbook of advanced materials testing, edited by N. P. Cheremisinoff and P. N. Cheremisinoff, Marcel Dekker Inc., New York, pp. 707-713 (1995)

  2. 廖建能, ”熱電效應之原理與應用介紹”,電子月刊,第93期160-167頁(2003年4月號)

  3. 廖建能, ”熱電材料之應用與未來展望”, 產業奈米技術應用資訊園地－奈米粉體與應用專刊, 113-123頁 (2004年8月號)

  4. C. N. Liao and C. T. Wei, “A Kinetic study of Sn/Cu bimetallic thin film reaction”, J. Mat. Sci. Eng., vol. 37, 82-86, (2005).

  5. 廖建能, 劉昆明 ” 電流輔助熱處理對Bi-Sb-Te奈米晶薄膜微結構與熱電特性之影響”,電子月刊,第180期134-141頁(2010年7月號).

  6. 廖建能;劉昆明;王昱筑;蘇小維;張志宇，“奈米熱電薄膜材料技術研發”，臺灣奈米會刊，8-15頁(2011年6月號)

  7. 廖建能, “電流輔助退火在熱電材料性能提升之應用” 工業材料雜誌 298期141-146頁(2011年10月號)

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