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(A)期刊論文

 

  1. C. N. Liao and K. N. Tu, (2002), “Direct measurement of contact temperature using Seebeck potential”, J. Appl. Phys., 92, 635 (SCI) NSC- 90-2218-E-007-067 IF:2.079   4

  2. C. N. Liao and K. C. Chen, (2003), “Current crowding effect on thermal characteristics of Ni/doped-Si contacts”, IEEE Electron Device Letters, 24, 637 (SCI) NSC-91-2216-E007-050 IF:2.719  1

  3. C. N. Liao and C. T. Wei, (2004),”Effect of intermetallic compound formation on electrical properties of Cu/Sn interface during thermal treatment”, J. Electron. Mat., 33, 1137 (SCI) NSC-92-2216-E-007-023 IF:1.421   12

  4. C. N. Liao and K. M. Liou, (2005), “Electrical properties of Cu/Ta interfaces under electrical current stressing”, J. Vac. Sci. Tech. A, 23, 359 (SCI) IF:1.291   2

  5. C. N. Liao and S. W. Kuo, (2005), “Thermoelectric characterization of sputter-deposited Bi/Te bilayer thin films”, J. Vac. Sci. Tech. A, 23, 559 (SCI) NSC-93-2216-E-007-026 IF:1.291   5

  6. C. N. Liao and K. C. Chen, (2005) “Effect of interfacial resistance and contact size on current crowding at Ni/poly-Si junctions”, Semi. Sci. Tech., 20, 659 (SCI) IF:1.333  1

  7. C. N. Liao, K. C. Chen, W. W. Wu and L. J. Chen, (2005) “In situ transmission electron microscope observations of electromigration in copper lines at room temperature”, Appl. Phys. Lett., 87, 141903. (SCI) IF:3.841   14

  8. C. N. Liao, C. P. Chung and W. T. Chen, (2005) “Electromigration induced Pb Segregation in Eutectic Sn-Pb Molten Solder”, J. Mat. Res., 20, 3425 (SCI) NSC-93-2216-E-007-045 IF:1.402   1

  9. C. N. Liao and C. T. Wei, (2006) “An isochronal kinetic study of intermetallic compound growth in Sn/Cu thin film couples”, Thin Solid Films, 515, 2781 (SCI) NSC-92-2216-E-007-023 IF:1.935   6

  10. C. N. Liao, H. N. Wu, P. C. Chen and J. W. Yeh, (2006) “Effect of antimony doping on thermoelectric properties of Zr0.5Ti0.5NiSn multi-element alloys”, ANNALES DE CHIMIE - science des matériaux, 31(6), 711 (SCI) NSC-93-2216-E-007-026.   0

  11. C. N. Liao, T. H. She, P. J. Liao and H. S. Chu, (2007) “Oscillatory transport properties of thermally annealed Bi/Te multilayer thin films”, J. Electrochem. Soc. 154 (4), H304 (SCI) NSC-94-2216-E-007-019. IF:2.427   3

  12. C. M. Tai and C. N. Liao, (2007) “Multi-level suspended thin film inductors on silicon wafers”, IEEE Trans. Electron. Dev., 54 (6), 1510 (SCI) IF:2.267   0

  13. C. N. Liao and T. H. She, (2007) “Preparation of bismuth telluride thin films through interfacial reaction”, Thin Solid Films, 515, 8059 (SCI) NSC-94-2216-E-007-019. IF:1.935  8

  14. K. C. Chen, C. N. Liao, W. W. Wu and L. J. Chen, (2007) “Direct observation of electromigration-induced surface atomic steps in Cu lines by in-situ transmission electron microscopy”, Appl. Phys. Lett., 90, 203101. (SCI) IF:3.841   9

  15. C. M. Chen, C. C. Huang, C. N. Liao, and K. M. Liou, (2007) “Effects of copper doping on microstructural evolution in eutectic SnBi solder stripes under annealing and current stressing”, J. Electron. Mat. 36, 760 (SCI) IF:1.421   13

  16. C. N. Liao, C. H. Lee and W. J. Chen, (2007) “Effect of interfacial compound formation on contact resistivity of soldered junctions between bismuth telluride based thermoelements and copper”, Electrochem. Solid-State Lett., 10(9), P23 (SCI) NSC 95-2221-E-007-051 IF:1.981   2

  17. C. M. Tai and C. N. Liao, (2007) ”A Physical Model of Solenoid Inductors on Silicon Substrates”, IEEE Trans. Microwave Theory Tech., 55(12), 2579 (SCI) IF:2.025   6

  18. C. N. Liao, K. M. Liou and H. S. Chu, (2008) “Enhancement of thermoelectric properties of sputtered Bi-Sb-Te thin films by electric current stressing”, Appl. Phys. Lett., 93, 042103. (SCI) NSC-96-2628-E-007-018-MY3 IF:3.841   15

  19. K. C. Chen, W. W. Wu, C. N. Liao, L. J. Chen and K. N. Tu, (2008) “Observation of Atomic Diffusion at Twin-modified Grain Boundaries in Copper”, Science, 321, 1066 (SCI) NSC-96-2628-E-007-018-MY3 IF:31.377   57

  20. S. D. Li, J. G. Duh and C. N. Liao, (2008) “High-frequency ferromagnetic inductors covered by as-deposited FeCoAlO films with stress-induced uniaxial anisotropy”, Thin Solid Films, 516, 7748 (SCI) IF:1.935  5

  21. C. N. Liao and C. H. Lee, (2008) “Suppression of vigorous liquid Sn/Te reactions by Sn-Cu solder alloys”, J. Mat. Res., 23, 3303 (SCI) NSC-96-2628-E-007-018-MY3 IF:1.402   3

  22. C. N. Liao, Y. C. Wang and H. S. Chu, (2008) “Thermal transport properties of nanocrystalline Bi–Sb–Te thin films prepared by sputter deposition”, J. Appl. Phys., 104, 104302 (SCI) NSC-96-2628-E-007-018-MY3 IF:2.079   7

  23. C. N. Liao and L. C. Wu, (2009) “Enhancement of carrier transport properties of BixSb2-xTe3 compounds by electrical sintering process”, Appl. Phys. Lett., 95, 052112. (SCI) NSC-96-2628-E-007-018-MY3 IF:3.841   3

  24. C. N. Liao, L. C. Wu and J. S. Lee, (2010) “Thermoelectric properties of Bi-Sb-Te materials prepared by electric current stressing”, J. Alloys Compd., 490, 468. (SCI) NSC-96-2628-E-007-018-MY3 IF:2.135   7

  25. C. N. Liao and Y. C. Huang, (2010) “Effect of Ag addition in Sn on growth of SnTe compound during reaction between molten solder and tellurium”, J. Mat. Res., 25, 391 (SCI) NSC-96-2628-E-007-018-MY3 IF:1.402   2

  26. C. N. Liao, C. Y. Chang and H. S. Chu, (2010) “Thermoelectric properties of electrically stressed Sb/Bi–Sb–Te multilayered films”, J. Appl. Phys., 107, 066103 (SCI) NSC-96-2628-E-007-018-MY3 IF:2.079   2

  27. K. M. Liou and C. N. Liao, (2010) “Electric current enhanced defect elimination in thermally annealed Bi-Sb-Te and Bi-Se-Te thermoelectric thin films”, J. Appl. Phys., 108, 053711 (SCI) NSC-96-2628-E-007-018-MY3 IF:2.079   1

  28. K. C. Chen, W. W. Wu, C. N. Liao, L. J. Chen and K. N. Tu, (2010) “Stability of nanoscale twins in copper under electric current stressing”, J. Appl. Phys. 108, 066103 (SCI). IF:2.079   1

  29. C. N. Liao, H. D. Shih and P. W. Su, (2010) “Electrocrystallization of Mutually Crossed Bismuth Telluride Nanoplatelets”, J. Electrochem. Soc. 157, D605 (SCI) NSC 98-3114-E-007-008. IF:2.427   0

  30. C. N. Liao, W. T. Chen and C. H. Lee, (2010) “Polarity effect on interfacial reactions at soldered junctions of electrically stressed thermoelectric modules”, Appl. Phys. Lett. 97, 241906. (SCI) NSC 98-3114-E-007-008. IF:3.841   0

  31. C. H. Lee, W. T. Chen and C. N. Liao, (2011) “Effect of antimony on vigorous interfacial reaction of Sn-Sb/Te couples”, J. Alloys Compd., 509, 5142 (SCI) NSC 98- 3114-E-007-008. IF:2.135  0

  32. C. N. Liao, X. W. Su, K. M. Liou and H. S. Chu, (2011) “Electrical and thermal transport properties of electrically stressed Bi-Sb-Te nanocrystalline thin films”, Thin Solid Films, 519, 4394. (SCI) NSC 98- 3114-E-007-008. IF:1.935   0

  33. T. C. Chan, K. C. Chen and C. N. Liao, (2011) “Surface roughness reduction of nanocrystalline Cu thin films by electrical stressing treatment”, Appl. Phys. Lett., 98, 181902. (SCI) NSC 99-2221-E-007-023-MY3. IF:3.841   2

  34. T. C. Chan, Y. L. Chueh and C. N. Liao, (2011) “Manipulating the crystallographic texture of nanotwinned Cu films by electrodeposition”, Cryst. Growth Des., 11, 4970. (SCI) NSC 99-2221-E-007-023-MY3. IF:4.390   0

  35. S. S. Lin and C. N. Liao, (2011) “Effect of ball milling and post treatment on crystal defects and transport properties of Bi2(Se,Te)3 compounds”, J. Appl. Phys., 110, 093707 NSC 98- 3114-E-007-008. IF:2.079  1

  36. T. Y. Lin, C. N. Liao, A. T. Wu, (2012) “Evaluation of diffusion barrier between lead-free solder systems and thermoelectric materials”, J. Electron. Mat. 41, 153 (SCI) IF:1.421  0

  37. C. N. Liao, Y. C. Lu and D. Xu, (2013) “Modulation of crystallographic texture and twinning structure of Cu nanowires by electrodeposition”, J. Electrochem. Soc. 160 (6), D207 (SCI) NSC-99-2221-E-007-023-MY3 2.588

  38. M.-P. Lu and C. N. Liao, (2013) “Mechanical and thermal processing effects on crystal defects and thermoelectric transport properties of Bi2(Se,Te)3 compounds”, J. Alloys Comp. 571,178–182. (SCI) NSC-101-2628- E-007-018-MY2 2.390, 4/76

  39. C. N. Liao, C.-Y. Lin, C.-L. Huang and Y.-S. Lu, (2013) “Morphology, Texture and Twinning Structure of Cu Films Prepared by Low-temperature Electroplating”, J. Electrochem. Soc. 160 (12), D3070 (SCI) NSC-99-2221-E-007-023-MY3

  40. H.-H. Huang, M.-P. Lu, C.-H. Chiu, L.-C. Su, C. N. Liao, J.-Y. Huang, H.-L. Hsieh, (2013) “Enhanced Seebeck coefficient of bismuth telluride compounds with graded doping profiles”, Appl. Phys. Lett., 103, 163903. (SCI) NSC-101-2628- E-007-018-MY2 3.794 20/128

  41. P. H. Le, C. N. Liao, C. W. Luo, J.-Y. Lin, J. Leu, (2013) “Thermoelectric properties of bismuth-selenide films with controlled morphology and texture grown using pulsed laser deposition”, Appl. Surf. Sci., 285P, 657-663 (SCI). 2.112

  42. T. C. Chan, Y. M. Lin, H. W. Tsai, Z. M. Wang, C. N. Liao, Y. L. Chueh, (2014) “Growth of large-scale nanotwinned Cu nanowire arrays from anodic aluminum oxide membrane by electrochemical deposition process: Controllable nanotwin density and growth orientation with enhanced electrical endurance performance”, Nanoscale, 6, 7332. (SCI) NSC-99 -2221-E-007-023-MY3.

  43. H. W. Tsai, T. H. Wang, T. C. Chan, P. J. Chen, C. C. Chung, A. Yaghoubi, C. N. Liao, E. W.-G. Diau, Y. L. Chueh, (2014) “Fabrication of Large Scale Single Crystal Bismuth Telluride (Bi2Te3) Nanosheet Arrays by Single Step Electrolysis Process”, Nanoscale, 6, 7780. (SCI)

  44. Y. L. Liu and C. N. Liao, (2014) “Experimental and theoretical assessments of thermal boundary resistance between Bi0.4Sb1.6Te3 thin films and metals”, Appl. Phys. Lett., 105, 013903. (SCI) NSC-101-2628- E-007-018-MY2

  45. P. H. Le, C. N. Liao, C. W. Luo, J. Leu, (2014) “Thermoelectric properties of nanostructured bismuth-telluride thin films grown using pulsed laser deposition”, J. Alloys Comp. 615, 546–552. (SCI)

  46. P.-J. Chen and C. N. Liao, (2014) “Thermoelectric transport properties of Bi-Te based thin films on strained polyimide substrates”, Appl. Phys. Lett., 105, 133903. (SCI) NSC-101-2628- E-007-018-MY2

  47. T.-C. Chan, Y.-Z. Chen, Y.-L. Chueh*, C. N. Liao*, (2014) “Large-scale nanotwins in copper films/Cu nanowires via stress engineering by high energy ion beam bombardment process: growth and characterization”, J. Mater. Chem. C, 2, 9777-10038. (SCI) NSC-99 -2221-E-007-023-MY3. (Inside front cover)

  48. C.-J. Yang, C.-L. Huang and C. N. Liao*, (2015) “Enhancing chemical stability of electroplated Cu films by engineering electrolyte chemistry and twinning structure”, J. Electron. Mat. 44, 2529 (SCI) NSC 102-2221-E-007-048-MY3

  49. C.-L. Huang and C. N. Liao*, (2015) “Chemical reactivity of twin-modified copper nanowire surfaces”, Appl. Phys. Lett., 107, 021601 (SCI) NSC 102-2221-E-007-048- MY3.

  50. M.-P. Lu, C. N. Liao*, J.-Y. Huang, H.-C. Hsu, (2015) “Thermoelectric Properties of Ag-Doped Bi2(Se,Te)3 Compounds: Dual Electronic Nature of Ag-Related Lattice Defects”, Inorg. Chem., 54, 7438. (SCI) MOST 103-2221-E-007 -035  4/45

  51. H.-P. Chen, C.-W. Huang, C.-W. Wang, W.-W. Wu, C.-N. Liao, L.-J. Chen and K.-N. Tu, (2016), “Optimization of the nanotwin-induced zigzag surface of copper by electromigration”, Nanoscale, 8, 2584.

  52. Y.-T. Huang, C.-W. Huang, J.-Y. Chen, Y.-H. Ting, S.-L. Cheng, C.-N. Liao and W.-W. Wu, (2016), “Mass transport phenomena in copper nanowires at high current density”, Nano Research, 9, 1071.

  53. H.-H. Huang, M.-P. Lu and C. N. Liao*, (2016), “Transverse thermoelectric effect of asymmetrically doped Bi-Sb-Te compounds”, J. Appl. Phys., 119, 205101.

  54. T. T. Shen, C. N. Liao*, (2017), “Enhancement of fatigue resistance of Bi-Sb-Te films on flexible substrates by current-assisted thermal annealing”, Mater. Lett., 186, 314-317.

  55. J.-S. Lee, W.-L. Weng, C. N. Liao*, (2017), “Characterization and modeling of twinning superlattice structure in copper nanowires”, Mater. Lett., 194, 23-25.

  56. Y.-H. Chen and C. N. Liao*, (2017), “Scattering characteristics of grain boundaries in electrically sintered Bi0.4Sb1.6Te3 compounds”, Mater. Lett., 197, 21-23.

  57. Y.-H. Chen and C. N. Liao*, (2017), “Transport properties of electrically sintered bismuth antimony telluride with antimony nanoprecipitation”, Appl. Phys. Lett., 111, 143901.

  58. C.-L. Huang, W.-L. Weng, C. N. Liao*, K. N. Tu, (2018) “Suppression of interdiffusion- induced voiding in oxidation of copper nanowires with twin-modified surface”, Nat. Commun. 9, 340.

  59. C.-T. Li, Y.-H. Chen, C. N. Liao*, (2018) “Electrically motivated atomic migration and defect formation in Bi0.5Sb1.5Te3 compounds”, Mater. Chem. Phys., 204, 373-377. (SCI)

  60. J.-C. Hsiao, Y.-H. Chen, C. N. Liao*, (2018) “Anisotropic thermal conductivity of sputtered Bi0.5Sb1.5Te3 films after current-assisted thermal treatment”, Thin Solid Films, 645, 93-96.

  61. W.-L. Weng, C.-Y. Hsu, J.-S. Lee, H.-H. Fan, C. N. Liao*, (2018) “Twin-mediated epitaxial growth of highly lattice-mismatched Cu/Ag core–shell nanowires”, Nanoscale, 10, 9862-9866.

  62. C.-L. Huang, W.-L. Weng, Y.-S. Huang C. N. Liao*, (2019) ”Enhanced photolysis stability of Cu2O grown on Cu nanowires with nanoscale twin boundaries”, Nanoscale, 11, 13709 - 13713. DOI: 10.1039/c9nr01406c. (Outside Back Cover).

  63. H.-H. Fan, W.-L. Weng, C.-Y. Lee, C. N. Liao*, (2019) “Electrochemical Cycling-Induced Spiky CuxO/Cu Nanowire Array for Glucose Sensing”, ACS Omega, 4, 12222 – 12229.

  64. C.-Y. Lan, C.-Y. Hsu, Y.-C. Lee, C. N. Liao*, (2020) “Grain growth behavior and enhanced thermoelectric properties of PbTe consolidated by high-density pulse current”, J. Alloys Comp., 815, 1526582.

  65. P.-C. Wei, C. N. Liao, H.-J. Wu, D. Yang, J. He, G. V. Biesold-McGee, S. Liang, W.-T. Yen, X. Tang, J.-W. Yeh, Z. Lin, and J. H. He (2020), “Thermodynamic routes to ultra-low thermal conductivity and high thermoelectric performance”, Adv. Mater., 32, 1906457.

  66. P.-S. Chang and C. N. Liao*, (2020), “Screen-printed flexible thermoelectric generator with directional heat collection design”, J. Alloys Comp., 836, 155471.

  67. C.-W. Chen and C. N. Liao*, (2021) “Enhanced thermoelectric properties of screen-printed Bi-Sb-Te films on flexible substrate by electrical sintering process”, Mater. Chem. Phys. 259, 124006.

  68. Y.-S. Huang, H.-Y. Chen and C. N. Liao*, (2021) “Growth of nanotwinned Cu nanowires in modified anodic aluminum oxide templates” Mater. Lett. 288, 129381.

  69. H.-Y. Chen, Y.-S. Huang and C. N. Liao*, (2021) “Electrodeposition and growth mechanism of nanotwinned copper in high aspect-ratio via structures” J. Electrochem. Soc. 168, 102503.

  70. M.-J. Yang, M. Y. Fakhri, C. N. Liao*, K.-H. Chen, (2022) “Synthesis and characterization of Ge-Ag-Sb-S-Se-Te high-entropy thermoelectric alloys” Mater. Lett. 311, 131617.

  71. P.-H. Sung, C.-Y. Huang, C.-Y. Lin, P.-W. Chung, Y.-C. Chang, L.-C. Chen, H.-Y. Chen, C. N. Liao,*, E.-L. Chiu, C.-Y. Wang, (2022) “Photocatalytic CO2 Reduction for C2-C3 Oxy-compounds on ZIF-67 Derived Carbon with TiO2”, J. CO2 Util. 58, 101920.

  72. S.-Y. Chien, L.-C. Hou , C.-C. Li , C. N. Liao*, (2022) “Flexible thermoelectric generators prepared by dispenser printing technology”, Mater. Chem. Phys. 287, 126269.

  73. T.-K. Chang, Y.-S. Huang, H.-Y. Chen, C. N. Liao*, (2022) “Photoelectrochemical Enhancement of Cu2O by a Cu2Te Hole Transmission Interlayer”, ACS Appl. Mater. Interfaces 14, 48540−48546. (Inside Cover).

  74. W.-L. Weng, H.-Y. Chen, Y.-H. Ting, H.-Y. T. Chen, W.-W. Wu, K. N. Tu, C. N. Liao*, (2022) “Twin-boundary Reduced Surface Diffusion on Electrically Stressed Copper Nanowires”, Nano Lett. 22, 9071−9076.

  75. J.-C. Yu, H.-C. Chien, C.-Y. Chiang, E.-C. Liu, Y.-H. Chang, H.-H. Huang, T.-Y. Chen, C.-L. Kao, C. N. Liao* (2023)“ High-performance electrodeposited copper wicks for heat-spreading vapor chambers“, Appl. Therm. Eng. 228, 120495 (IF: 6.4, MECHANICS, 9/137).

  76. E.-C. Liu, J.-C. Yu, C.-Y. Chiang, C. N. Liao* (2023) “Enhancing capillary performance of copper wicks by electrodeposition of superhydrophilic dendritic structures“, Mater. Chem. Phys. 307, 128207.

  77. C.-Y. Chiang, J.-C. Yu, E.-C. Liu, S.-W. Chiu, C.-N. Liao* (2023) “Enhanced Capillary Performance of Hierarchical Dendritic Copper Surface for Ultra-thin Heat-spreading Devices”, Phys. Fluids 35, 072117 (IF: 4.6, PHYSICS, FLUIDS & PLASMAS, 2/34).

  78. S.-Y. Chen, L.-Y. Wang, K.-C. Chen, C.-H. Yeh, W.-C. Hsiao, H.-Y. Chen, M. Nishi, M. Keller, C.-L. Chang, C. N. Liao, T. Mochizuki, H.-Y. Tiffany Chen, H. H. Chou, C.-M. Yang, (2024) “Ammonia synthesis over cesium-promoted mesoporous-carbon-supported ruthenium catalysts: Impact of graphitization degree of the carbon support”, Appl. Catal., B, 346, 123725. (IF:22.1, ENGINEERING, ENVIRONMENTAL, 1/55)

  79. J.-C. Yu, C. N. Liao*, Y.-H. Chang, H.-H. Huang, C.-C. Wang, C.-P. Hung (2024) “Enhanced Heat Spreading Performance of Printed Circuit Boards by Vapor Chamber Implementation”, IEEE Trans. Compon. Packag. Manuf. Technol., 14, 221-228.

  80. H.-Y. Chen, M.-C. Tai, C. N. Liao* (2024) “Mechanistic understanding of enhanced thermal stability of twinned copper nanowires”, Mater. Today Phys., 43, 101407. (IF: 11.5, PHYSICS, APPLIED, 14/160)

  81. Y.-F. Tsai, M.-J. Yang, J.-R. Deng, C. N. Liao, H.-J. Wu* (2024) “Reducing Domain Density Enhances Conversion Efficiency in GeTe”, Small, 20, 2312206 (IF:13.3, PHYSICS, APPLIED, 11/160)

  82. H.-Y. Chen, S.-Y. Chen*, Y. I. A. Reyes, M. Keller, T. Mochizuki, C. N. Liao, H.-Y. T. Chen*, (2024) “Promotion effects in ammonia synthesis over ruthenium catalysts: A review”, EnergyChem, 6, 100140. (IF:22.2, ENGINEERING, CHEMICAL, 3/170)

  83. Y. C. Huang, H.-Y. Chen, C. N. Liao* (2025) “Electrodeposition of Cu nanowires with ultrahigh-density twin boundaries: An electrochemical perspective on nanotwinning”, Nanoscale, 17, 2312 – 2317. DOI: 10.1039/D4NR03537B. (IF: 5.8, PHYSICS, APPLIED, 33/179)

  84. P.-H. He, C.-Y. Chiang, J.-C. Yu, E.-C. Liu, C. N. Liao* (2025) “Effect of Hydrogen Evolution on Morphology and Capillary Performance of Electrodeposited Copper Wicks”, Mater. Chem. Phys. 337, 130560.

  85. H.-Y. Chen, H.-Y. T. Chen and C.-N. Liao* (2025) “Mechanistic understanding of self-limiting oxidation behavior of copper nanowires with dense twin boundaries”, Appl. Surf. Sci. 692, 162753.

  86. C.-Y. Chiang, P.-H. He, H.-C. Chien, J.-C. Yu, E.-C. Liu, L.-C. Chen, Y.-H. Chang, H.-H. Huang, C.-C. Wange, C.-P. Hung, C. N. Liao* (2025) “Implementation of Hierarchical Dendritic Wicks in Vapor Chambers for High-Power Heat Dissipation Applications“, Appl. Therm. Eng. 126295. (IF: 6.1, ENGINEERING, MECHANICAL, 10/183)

 

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